Level Measurement Technology that Meets All Challenges Head On
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Level Measurement Technology that Meets All Challenges Head On

In its quest to continually improve its industry-leading bulk solids level and volume measurement devices, APM has added further functionality and certifications to its products to broaden the applicability, reduce maintenance, and further ease the integration process.

“Uneven surfaces, irregular build-up and harsh, dusty and potentially explosive environments make measuring the level of solids in large vessels problematic, impacting inventory control decisions,” said Asael Sharabi, technical director at Emerson Process Management, APM’s parent company.
“APM instrumentation meets these challenges to provide users with greater control of inventories and entire manufacturing processes, with significant financial benefits,” said Sharabi.

The importance of inventory control in business cannot be overstated. APM’s 3DLevelScanner Series uses acoustic measurement and 3D mapping technology to supply the most accurate continuous level and volume measurement in real-time. And it can now be used in potentially explosive atmospheres due its ATEX/IECEx certification.
Similarly, a new mounting adaptor allows the scanner be installed in electrostatic precipitator (ESP) hoppers. The 3D visualization enables process optimization as well as cost reductions, safety improvements, and reduced maintenance costs.
The APM 3DLevel Scanner not only has new applications, it can also now be used virtually anywhere. Both the solids scanner and the APM 5402 Non-contacting Radar for smaller storage containers can be used wirelessly in remote areas without cable infrastructure. This is done via connection with a WirelessHART® network using a Smart Wireless THUMTM Adaptor. This integration process is quicker, cheaper, and easier than other options.

To further ease the burden of installation and integration, there is now full SCADA integration support for the solids scanner. It is now easier than ever before to seamlessly integrate the 3D visualization of the surface level into Emerson’s OvationTM or DeltaVTM distributed control systems and deliver the results directly to control room operators.
To further reduce device maintenance an air purging connection for the APM 5402 has been developed that prevents clogging of the antenna in very dusty environments. And in environments where there are extremely sticky materials, the self-cleaning function on the APM 3DLevelScanner can now be further enhanced with a new PTFE coated antenna.

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Taking the guesswork out of bulk solids measurements